What do you get when you cross Colorfabb PLA/PHA with fine copper powder?
Copperfill of course.
You can find the relevant data sheets Here
Heated Bed Temp
50-60C° (Heated bed not required)
1.75mm and 2.85mm
Glass Transition Temp
Here are a few Tips from ColorFabb
TIP! Depending on your set-up, 3d printer and slice software, you might see that copperFill needs a bit more flow compared to your normal PLA settings. Most plastics will show die swell when coming out of the nozzle tip, this is counteracted with specific slicer settings. Since copperFill doesn’t show a die swell such as PLA you might need to increase flow rate a bit, 4-8% was perfect for our UM2. UM original did not need any adjustments.
TIP! Sanding and polishing your parts will make the copper particles shine. Start sanding with grit 120-180 and make sure all the printed lines vanish. You’ll notice that because copperFill is easy to sand down, careful you won’t loose too much detail. Then start working your way up by following with grit 240-320 and finishing off with grit 600 - or higher. Finally we used a clean soft cloth and some copper polish to really get all of the shine out of the copper particles.